Wafer-level Vacuum Packaged X and Y axis Gyroscope Using the Extended SBM Process for Ubiquitous Robot applications
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چکیده
* School of Electrical Engineering and Computer Sciences, ASRI, ISRC, Seoul National University, Seoul, Korea (e-mail: [email protected]) SML Electronics, Inc., Seoul, Korea (e-mail: [email protected]) *** School of Electrical Engineering and Computer Sciences, ASRI, ISRC, Seoul National University, Seoul, Korea (e-mail: [email protected]) **** School of Electrical Engineering and Computer Sciences, ASRI, ISRC, Seoul National University, Seoul, Korea (e-mail: [email protected]) SML Electronics, Inc., Seoul, Korea (e-mail: [email protected]) ***** School of Electrical Engineering and Computer Sciences, ASRI, ISRC, Seoul National University, Seoul, Korea (e-mail: [email protected]) ******* School of Electrical Engineering and Computer Sciences, ASRI, ISRC, Seoul National University, Seoul, Korea (Tel: +82-2-880-8371; e-mail:[email protected])
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تاریخ انتشار 2008